Nitto Denko Corporation has been rapidly capturing market demand since its establishment in 1918, focusing on bonding technology and coating technology in the group’s basic technology, in the electronics industry, automobiles, housing, infrastructure, and environmental As well as medical and other related fields, we have developed a wide range of businesses around the world. Nitto’s main products include: double-sided tape, surface protection film, sealing material, masking tape, film products, FPD/touch screen related products, flexible printed circuit boards, dust removal products for clean rooms, etc. In terms of semiconductor manufacturing technology, wafer processing, back grinding, dicing, molding and other products are also very mature. There are tearing machines that are suitable for peeling the protective tape from the patterned wafer surface after the back grinding process. A fully automatic wafer mounter where dicing tape is attached to the back of the wafer/dicing frame. Nitto adheres to the president philosophy of "Facing a century-old company for sustainable development, accelerating the process of globalization, and contributing to the creation of value for customers with new ideas", and on the road of sustainable development, join hands with Yoshinaga Corporation to serve more Of Chinese semiconductor customers.
Company website: http://www.nitto.com
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